High-Precision Die Bonder "AB-1000" <Manufactured by Athlete FA>
High-speed Die Bonder compatible with micro and thin chips!
We would like to introduce the high-precision die bonder "AB-1000" manufactured by Athlete FA, which we handle. It achieves mounting accuracy of XY: ±5[μm], θ: ±1[deg] (±3σ). It is compatible with small and thin chips. It comes with calibration, traceability, and post-mount inspection functions. Please feel free to contact us if you have any requests. 【Features】 ■ Achieves high-precision mounting ■ Compatible with small and thin chips ■ Equipped with calibration function ■ Equipped with traceability function ■ Equipped with post-mount inspection function *For more details, please refer to the PDF document or feel free to contact us.
- Company：日精 本社
- Price：50 million yen-100 million yen
